信步科技SCM-6100U嵌入式主板介绍_诺佳网——最实用的IT互联网信息网站

信步科技SCM-6100U嵌入式主板介绍

时间：2019-10-09 15:50

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作者：admin

导读：Intel Skylake-U Core i3-6100U CPUConnect carrier board through B2BOne carrier board is compatible with different SCM6*COM, 12*USB, 2*1000Mbps LAN1*eDP/LVDS, 1*VGA/DDI1, 1*DDI285*95mm, 5V Input...

Intel Skylake-U Core i3-6100U CPU, 6*COM, 12*USB, 2*LAN, SCM (Seavo Compute Module)

Intel Skylake-U Core i3-6100U CPU
Connect carrier board through B2B
One carrier board is compatible with different SCM
6*COM, 12*USB, 2*1000Mbps LAN
1*eDP/LVDS, 1*VGA/DDI1, 1*DDI2
85*95mm, 5V Input

规格

General
CPU	Intel^® 6^th Core™ i3-6100U, Dual-core, 2.3 GHz, TDP15W
Chipset	Null
Memory	DDR4-2133, 1*SO-DIMM, up to 16 GB
Storage	1*eMMC 8/16/32G
BIOS	AMI UEFI BIOS
System	Windows7/8/10, Linux
I/O Interface
Serial Port	6*RS232
USB 2.0	8*USB 2.0
Ethernet	2*Intel^®1Gbps PCIe Ethernet Controller
Audio	Realtek^®5.1 channel HDA Codec
HighSpeed Signal	4USB 3.0, 5PCI, 1SATA 2HSIOA(USB 3.0/PCIe), 2* HSIOB(SATA/PCIe)
GPIO	8 programmable GPIO
Feature Interface	LPC, SM BUS, I2C, USB OC, FAN, Power Control, Power OK
Display
Display Interface	1eDP/LVDS 1VGA/DDI1 1*DDI2 (DDI can be set to DP/HDMI/DVI)
Multiple Display
Mechanical & Environment
Dimension	85*95mm
Power Input	5V
Temperature	Operation: 0℃~60℃, Storage: -25℃~75℃
Relative Humidity	Operation: 10%~90%, Storage: 5%~95%, non-condensing